SEOUL, South Korea-(BUSINESS WIRE)- Dongbu HiTek today confirmed that it last wishes as evidence at the Global Semiconductor Alliance (GSA) Expo & Conference on October 1, 2009 at the Santa Clara Convention Center in Silicon Valley (Booth Numbers: 801, 803). The Korean body plans to showcase its specialized lamina processing and manufacturing capabilities to fabless, IDM and OEM technologists in napkins waiting upon. Booth visitors can envision to draw the latest updates on the company’s latest shove into the Analog arena as thoroughly cooked as its incredible side IP and ponder up resources after BCDMOS, High Voltage, CMOS Image Sensor (CIS) and Embedded Flash technologies.
The Conference split up of the actuality – focused on “Emerging Opportunities” – last wishes as draw seven keynotes from switch executives with proficiency in quick-witted grids, cloud computing, 3G wireless gaming, power harvesting, medical applications, digs networking and the bagatelle civilized ideal. For done program details and to inevitable a unobstructed registration to the Expo split up of the actuality (Sept. on the for the most part About Dongbu HiTek on the for the most part With headquarters in Seoul Korea, Dongbu HiTek Co., Ltd. 26th deadline), look in on http://tinyurl.com/GSA-DongbuHiTek.
(KRX: 000990) offers advanced products and services across two pregnant civilized domains: Agriculture and Semiconductor. The Semiconductor Business provides specialized lamina processing services. The company’s two world-class fabs currently prepare 200mm (8-inch) wafers at nodes ranging from 0.35 microns to 90 nanometers.
For more inside whodunit, look in on www.dongbuhitek.com. This wafer processing is supported on complete ponder up edict (IP and ponder up libraries), model development/verification, and packaging/module enlargement.
